ct micro rev 0 (preliminary) proprietary & confidential page 1 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter package outline schematic features ? small double - end package ? viewing angle at x axis (note3) = ? 5 5 0 ? high reliability ? good spectral matching to si photo detector ? rohs compliance applications ? i nfrared sensor ? l ight barrier ? inf rared touch panel solutions description the irp2406w14 - b1 0 is a ga al as infrared led housed in a miniature smd package . the device has a peak wavelength of 940nm led spe ctral ly matched with phototransistor or photodiode . anode cath ode
ct micro rev 0 (preliminary) proprietary & confidential page 2 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter absolute maximum rating at 25 0 c symbol parameters ratings units notes i f continuous forward current 7 0 ma i fp peak forward current 0. 7 a 1 v r reverse voltage 5 v t opr operating te mperature - 40 ~ +85 0 c t stg storage temperature - 40 ~ +100 0 c t sol soldering temperature 260 0 c 2 p d power dissipation at(or below) 25 free air temperature 133 mw r thja junction to ambient thermal resistance 540 0 c/w electro - optical characteristics ta = 25c (unless otherwise specified) optical characteristics symbol parameters test conditions min typ max units notes ie radiant intensity i f =20ma 3.00 4.20 - mw/sr i f = 7 0 ma - 14.5 - p peak wavelength i f =20ma - 940 - nm ? spectral bandwidth i f =20ma - 50 - nm 1/2 angle of half intensity (x) i f =20ma - ? 55.0 - deg 3 angle of half intensity (y) - ? 27.5 - electrical characteristics symbol parameters test conditions min typ max units notes v f forward voltage i f =20ma 1.1 1. 33 1. 6 v i f =70 ma 1.2 1.57 1.9 i r reverse current v r =5v - - 10 a notes: 1 : i fp conditions -- pulse width Q 100s an d duty Q 1%. 2 : soldering time Q 5 seconds. 3 : test condition :
ct micro rev 0 (preliminary) proprietary & confidential page 3 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter typical characteristic curves
ct micro rev 0 (preliminary) proprietary & confidential page 4 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter typical characteristic curves
ct micro rev 0 (preliminary) proprietary & confidential page 5 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter package dimension all dimensions are in mm, unless otherwise stated recommen ded soldering mask all dimensions are in mm, unless otherwise stated ordering information p art number description quantity irp2406w14 - b10 tape & reel 5 000 pcs
ct micro rev 0 (preliminary) proprietary & confidential page 6 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter reel dimension all dimensions are in mm, unless otherwise stated tape dimension all dimensions are in mm, unless otherwise stated
ct micro rev 0 (preliminary) proprietary & confidential page 7 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter reflow profile profile feature pb - free assembly profile temperature min. (tsmin) 150c temperature max. (tsmax) 200c time (ts) from (tsmin to tsmax) 60 - 120 seconds ramp - up rate (t l to t p ) 3c/se cond max. liquidous temperature (t l ) 217c time (t l ) maintained above (t l ) 60 C 150 seconds peak body package temperature 260c +0c / - 5c time (t p ) within 5c of 260c 30 seconds ramp - down rate (t p to t l ) 6c/second max time 25c to peak temperatur e 8 minutes max.
ct micro rev 0 (preliminary) proprietary & confidential page 8 apr , 201 4 irp2406w 14 - b1 0 smd type 94 0nm infrared emitter disclaimer ct micro reserves the right to make changes without further notice to any products herein to improve reliability, function or design. ct micro does not assume any liability arising out of the application or us e of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. ______________________________________________________________________________________ ct micro are not authorized for use a s critical components in life support devices or systems without express written approval of ct micro international corp oration . 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) sup port or sustain life, or (c) whose failure to perform when properly used in accordance with instruction for use provided in the label l ing, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a li fe support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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